Find the latest Dymax press releases to learn about global and local company initiatives.
Explore Dymax solutions for bonding, cure validation, and process optimization at Booth 234.
New 75 mm and 150 mm line emitters deliver up to 4.2 W/cm² with 365/385/405 nm options and FX controller compatibility for scalable automation.
Fast light curing, reflow durability, and controlled edge bonding for reliable PCB reinforcement in advanced electronic assemblies.
Bringing technical expertise and faster service closer to customers.
Innovative Light-Curable Bonding and Protection Solutions for Battery and Electronics Manufacturing
New Adhesive Enables Reliable Bonding in Both Light and Shadowed Areas
The expansion of the Dymax Wiesbaden site is a logical step in supporting dynamic growth in the EMEA region.
Adhesives and equipment that address outgassing control, reliability, and performance requirements
Adhesive-focused demonstrations, dispensing methods, and curing solutions for medical device assembly will be featured.