Dual-Cure Electronic Encapsulant

Dymax 9209-W is a room-temperature reworkable, dual-cure encapsulant for wearable electronics, offering UV/visible light and secondary moisture curing, high impact and thermal resistance, and adhesion to common substrates. It is skin-safe, RoHS compliant, reworkable, and suitable for shadow areas, with properties optimized for devices like smartwatches, AR/VR headsets, and fitness trackers. Proper curing and handling are essential for optimal performance.

Typical applications include chip on board, chip on flex, or wire bond encapsulation, as well as selective protection of components from chemical or environmental exposures. This product bonds well to typical electronic substrates, including polyimide, polyamide, and FR4. 

9209-W dual-cure encapsulant is in full compliance with RoHS directives 2015/863/EU.

For medical wearable device assembly, see the Dymax 2000-MW series of biocompatible IBOA- and TPO-free adhesives.