Light Lines Newsletter Fall 2017 - Expand Your LED Curing Capabilities
LIGHT LINES NEWSLETTER | 2017 FALL ISSUE
New Multi-Cure® 9037-F is a resilient chip encapsulant designed for applications where a thixotropic, high viscosity encapsulant or a damming material is required. This is often the case for conventional glob top encapsulating applications – for chip on board or chip on flex – as well as many wire bonding applications. 9037-F cures under broad-spectrum UV light, but also includes secondary heat cure to address applications where shadow areas are present. The encapsulant has great flexibility and provides high moisture and thermal resistance. It also fluoresces blue when exposed to black light, allowing for easy inspection.
Protect connectors and board-level areas from both solvent-based and light-curable conformal coatings with SpeedMask® 9-7001. This peelable mask offers one-layer protection from wave solder and reflow processes, as well as during solvent-based or light-cure conformal coating application. It cures in just seconds with UV/Visible light and is also easily removable, eliminating the concern of ionic contamination or silicone left behind by other masking methods.
This next-generation curing system provides manufacturers with the curing flexibility of past systems but with new expansion capabilities. The high-intensity LED emitter delivers a 50 x 50 mm active curing area but multiple systems can be grouped together to create larger curing pattern matrixes as needed. With this new design, the system can be truly tailored to users’ curing needs – allowing them to choose from three different wavelength LED emitters (365, 385, or 405 nm) and providing additional flexibility with the size and pattern of the active curing area.
We are happy to announce that we are now offering some downloadable STEP files and dimensional drawings of our curing units. These new assets can be downloaded from the specific system pages and are currently available for the following units:
Nov. 15-17 | Booth E3.C25/27/29
The Shanghai New International Expo Center (SNIEC),
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