See-Cure Light-Curable BGA, CSP Reinforcement Adhesive

Ultra Light-Weld® 9422-SC adhesive cures upon exposure to UV/Visible light and is designed for rapid bonding and reinforcing components on printed circuit boards. It also offers high adhesion to electronic components and various printed circuit board (PCB) substrates making it ideal for component staking and ruggedizing. 9422-SC provides rapid bonding to lead frame, PCB, silicon, and ceramic. Dymax adhesives formulated with See-Cure color-change technology appear bright blue in their uncured state, making them very visible when dispensed onto substrates. The color transitions from blue to colorless upon cure.

Download  9422-SC Product Data Sheet     Download  Request SDS
Download  See-Cure Adhesives Selector Guide
Download  Leadless Component Ruggedization Adhesives Sheet

Dymax materials are solvent free and cure upon exposure to light. Their ability to cure in seconds results in lower processing costs. When cured with Dymax UV light curing spot lamps, focused beam lamps, flood lamps, or conveyor systems they deliver optimum speed and performance for maximum efficiency. Dymax lamps offer the optimum balance of UV and visible light for the fastest, deepest cures. This product is in full compliance with the RoHS Directives 2002/95/EC and 2003/11EC.

Viscosity (nominal):  38,000 cP

Uncured Appearance:  Blue Transparent Gel

Substrates:  Lead Frame; Ceramic; PCB; Silicon

Package Sizes Available*:
30 mL Syringe (MR)
160 mL Cartridge
300 mL Cartridge

*In Europe materials are sold in g/kg not mL/L
Reinforcing fine pitch or leadless components on printed circuit boards
Shock absorption
Underfill replacement
Component staking
Wire tacking

UV/Visible light cure
Solvent free
Blue-to-clear upon exposure to UV/Visible light
One part, no mixing required
Fast, room-temperature cure
Adhesion to various PCB substrates
Reduces stress on board components
Highly thixotropic for minimal movement after dispense