9309-SC

See-Cure Light-Curable BGA, CSP Reinforcement Adhesive


Ultra Light-Weld® 9309-SC adhesive cures upon exposure to UV/Visible light and is designed for rapid ruggedization of circuit board components. This edgebond material is ideal for applications where shock attenuation or ruggedization is necessary, including use as an alternative to underfill. 9309-SC provides rapid bonding to lead frame, PCB, silicon, and ceramic. This adhesive is compatible with both needle and jet dispensing systems and is highly thixotropic, minimizing movement after dispense. Dymax adhesives formulated with See-Cure color-change technology appear bright blue in their uncured state, making them very visible when dispensed onto substrates. The color changes from blue to clear upon cure.

Download  9309-SC Product Data Sheet     Download  Request SDS
Download  See-Cure Adhesives Selector Guide
Download  Leadless Component Ruggedization Adhesives Sheet

Dymax materials are solvent free and cure upon exposure to light. Their ability to cure in seconds results in lower processing costs. When cured with Dymax UV light curing spot lamps, focused beam lamps, flood lamps, or conveyor systems they deliver optimum speed and performance for maximum efficiency. Dymax lamps offer the optimum balance of UV and visible light for the fastest, deepest cures. This product is in full compliance with the RoHS Directives 2002/95/EC and 2003/11EC.

Viscosity (nominal):  45,000 cP

Uncured Appearance:  Blue Transparent Gel

Substrates:  Lead Frame; Ceramic; PCB; Silicon

Package Sizes Available*:
30 mL Syringe
300 mL Cartridge

*In Europe materials are sold in g/kg not mL/L
Applications:
Reinforcing fine pitch or leadless components on printed circuit boards
Shock absorption
Underfill alternative

Features:
UV/Visible light cure
Halogen-free
Solvent free
Blue-to-clear upon exposure to UV/Visible light
Tack-free surface after cure
Compatible with needle or jet dispensing equipment
Very low VOCs
Adhesion to various PCB substrates
Reduces stress on board components
Highly thixotropic for minimal movement after dispense