9-20801

Multi-Cure® Light-Curable Thermal Interface Adhesive


Multi-Cure® 9-20801 cures upon exposure to UV light, heat and/or activator and is designed for rapid mounting of heat-sensitive components on printed circuit boards to provide highly conductive bonds to heat-dissipation elements such as heat sinks. 9-20801 thermal interface material is a Multi-Cure® material specially formulated to cure with heat or activator between opaque substrates. Most high-speed processes call for dispensing 9-20801 on the substrate surface and then applying a thin layer of Dymax 501-E activator to the opposite component surface. The parts are mated and then exposed to light. This exposure cures the edges of the component in seconds so the parts are fixtured allowing for immediate handling and movement to the next step in the process. Material between opaque surfaces will cure over time, typically minutes or hours. Light cure allows for exposed areas to cure in seconds, fixturing parts in place so a secondary cure can effectively cure shadowed areas without interruption to process flow.

Download  9-20801 Product Data Sheet     Download  Request SDS

Dymax materials are solvent free and cure upon exposure to light. Their ability to cure in seconds results in lower processing costs. When cured with Dymax UV light curing spot lamps, focused beam lamps, flood lamps, or conveyor systems they deliver optimum speed and performance for maximum efficiency. Dymax lamps offer the optimum balance of UV and visible light for the fastest, deepest cures. This product is in full compliance with the RoHS Directives 2002/95/EC and 2003/11EC.

Viscosity (nominal):  110,000 cP

Uncured Appearance:  Off White

Substrates:  PCB; Ceramic; Lead Frame; Silicon; FR4; Metal

Package Sizes Available*:
10 mL Syringe (MR)
30 mL Syringe (MR)
160 mL Cartridge

*In Europe materials are sold in g/kg not mL/L
Applications:
Mounting heat sinks
Bonding heat sensitive components to PCBs

Features:
Halogen-free
Highly conductive
Fast UV light cure for immediate fixture strength
Secondary activator or heat cure
Thixotropic for easy dispense and placement prior to cure
Superior adhesion to FR4 and many metals