LED Light-Curable Adhesives

Dymax Offers Versatility in Light-Curing Technology

LED Light-Curable Adhesives

Dymax offers specially formulated LED light-curable adhesives for use with the BlueWave® LED Prime UVA high-intensity spot-curing system. The adhesives, which range from fast to ultra-fast cure speeds in order to accommodate specific medical device, electronic, and industrial assembly needs, can also be used with the Dymax BlueWave® LED DX-1000 system in spot mode. Dymax BlueWave LED systems offer significant advantages over conventional lamp-curing systems including cooler curing temperatures, lower intensity degradation over time, more consistent cure results, lower energy consumption, and reduced costs.

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UV LED Light-Curable Adhesives for use with Dymax BlueWave® LED Prime UVA and DX-1000 (spot mode)

Ultra-fast cure; clear; plastic bonder
Interfacial Cure Time*: 0.2 sec.
Key Substrates: ABS, PC, PVC, SAN, FR4
Viscosity, cPs: 300
Hardness: D65

Clear; high adhesion to plastics
Interfacial Cure Time*: 0.2 sec.
Key Substrates: ABS, PC, PVC, SAN, FR4
Viscosity, cPs: 125
Hardness: D65

Flexible; adhesion to a wide variety of plastics
Interfacial Cure Time*: 0.2 sec.
Key Substrates: PC, PVC, PET, PETG, PU, ABS
Viscosity, cPs: 25,000
Hardness: D55

Low stress and shrinkage; plastic bonder
Interfacial Cure Time*: 0.2 sec.
Key Substrates: PMMA, PC, PU, PS
Viscosity, cPs: 1,000
Hardness: D62

Ultra-fast cure; moisture resistant; Ultra-Red™ fluorescing
Interfacial Cure Time*: 0.2 sec.
Key Substrates: ABS, CAP, PC, PVC, SAN
Viscosity, cPs: 300
Hardness: D70

See-Cure version; low viscosity PVC and PET bonder
Interfacial Cure Time*: 0.2 sec.
Key Substrates: PVC, PET, ABS, PU
Viscosity, cPs: 110
Hardness: D70

PC and ABS plastic bonder with secondary moisture cure for shadowed areas; blue fluorescing; moisture and thermal resistance 
Interfacial Cure Time*: 0.1 sec.
Key Substrates: ABS, PC, PEI, PETG, PI, PSU, PVC
Viscosity, cPs: 150
Hardness: D55-D75

Flexible for shock absorption and vibration resistance; fast UV light cure; resists yellowing; clear; ideal for large area bonding
Interfacial Cure Time*: 4 sec.
Key Substrates: Glass, Metal, ABS, PVC
Viscosity, cPs: 2,500
Hardness: D60

Clear; high-temperature and moisture-resistant; high adhesion to glass, metals, and many plastics
Interfacial Cure Time*: 0.6 sec
Key Substrates: Glass, AL, SS, CU, Ceramic, FR4, BR, and many plastics
Viscosity, cPs: 500
Hardness: D70

Clear; high-temperature and moisture-resistant; high adhesion to glass, metals, and many plastics
Interfacial Cure Time*: 3.8 sec.
Key Substrates: Glass, AL, SS, CU, Ceramic, and many plastics
Viscosity, cPs: 6,000
Hardness: D70

Secondary heat or activator cure; forms hard, clear bonds to multiple substrates
Interfacial Cure Time*: 0.4 sec.
Key Substrates: Metals, Glass, Ceramic, Polyamide (filled/unfilled), Phenolic Plastics
Viscosity, cPs: 800
Hardness: D80

High-temperature and moisture resistant; flexible; secondary heat or activator cure
Key Substrates: Glass, Metals, Plastics
Viscosity, cPs: 500
Hardness: D70

High-temperature and moisture resistant; flexible; secondary heat or activator cure
Interfacial Cure Time*: TBD
Key Substrates: Glass, Metals, Plastics
Viscosity, cPs: 6,000
Hardness: D70
Solvent resistant wire-tacking adhesive with secondary heat cure; fluorescing
Interfacial Cure Time*: 1 sec.
Key Substrates: Ceramic, Leadframe, PCB, Silicon
Viscosity, cPs: 36,000
Hardness: D80

Chemically resistant conformal coating with secondary heat cure; fluorescing
Interfacial Cure Time*: N/A
Key Substrates: Ceramic, Leadframe, PCB, Flex, Silicon
Viscosity, cPs: 150
Hardness: D80

Resilient, clear encapsulant; excellent thermal cycling adhesive for potting
Interfacial Cure Time*: 1 sec.
Key Substrates: Ceramic, Leadframe, PCB, Flex, Silicon
Viscosity, cPs: 400
Hardness: D45

Resilient, clear encapsulant; excellent thermal cycling adhesive for potting
Interfacial Cure Time*: 0.8 sec.
Key Substrates: Ceramic, Leadframe, PCB, Flex, Silicon
Viscosity, cPs: 4,500
Hardness: D45

Resilient, clear encapsulant; excellent thermal cycling adhesive for potting
Interfacial Cure Time*: 1 sec.
Key Substrates: Ceramic, Leadframe, PCB, Flex, Silicon
Viscosity, cPs: 17,000
Hardness: D45

See-Cure version; highly thixotropic ruggedizing adhesive; reduces stress on board components
Interfacial Cure Time*: 0.2 sec.
Key Substrates: Ceramic, Leadframe, PCB, Silicon
Viscosity, cPs: 38,000
Hardness: D50

See-Cure version; highly thixotropic ruggedizing adhesive; reduces stress on board components
Interfacial Cure Time*: 0.2 sec.
Key Substrates: Ceramic, Leadframe, PCB, Silicon
Viscosity, cPs: 8,000
Hardness: D50
Clear; fluorescing; catheter and plastic bonding
Interfacial Cure Time*: 0.2 sec.
Key Substrates: PVC, PC, PU, ABS, PET
Viscosity, cPs: 500
Hardness: D55

Clear; fluorescing; catheter bonder; bonds plastic and metals
Interfacial Cure Time*: 0.4 sec.
Key Substrates: ABS, SS, PC, PVC, Glass, PMMA, PA
Viscosity, cPs: 300
Hardness: D70

Clear; catheter bonder; bonds a wide variety of plastics; moisture resistant
Interfacial Cure Time*: 0.2 sec.
Key Substrates: PC, PU, PS, PA, ABS, PVC
Viscosity, cPs: 150
Hardness: D65

See-Cure version; catheter bonder; bonds a wide variety of plastics; ideal for >1 W/cm2; ideal for 4-8 mil gaps
Interfacial Cure Time*: 0.2 sec.
Key Substrates: PC, PU, PS, SS, ABS, CAP, PA, PVC, SAN, TPU, FR-4
Viscosity, cPs: 450
Hardness: D70

See-Cure technology; Ultra-Red™ fluorescing; catheter assembly; marker band adhesive; moisture resistant; medium viscosity
Interfacial Cure Time*: 0.2 sec.
Key Substrates: Platinum, PC, PS, PVC, ABS, CAP, PA, PS, stainless steel
Viscosity, cPs: 10,000
Hardness: D62

Formulated with new Encompass™ technology that combines Dymax exclusive See-Cure color change and Ultra-Red™ fluorescing technologies with LED-curing capabilities; applications include balloon/lumen, hub/lumen, marker band adhesive, and manifold bond joints
Interfacial Cure Time*: 0.2 sec.
Key Substrates: Nylon 12, PC, PVC, ABS, PET, and PEBA
Viscosity, cPs: 20,000
Hardness: D53

Fast & tack-free cures; adhesion to wide variety of plastics; moisture resistant; Ultra-Red™ fluorescing
Interfacial Cure Time*: 0.2 sec.
Key Substrates: Plastics
Viscosity, cPs: 300
Hardness: D70

Fluorescing; secondary heat cure; impact resistant
Interfacial Cure Time*: 3 sec.
Key Substrates: SS, AL, NiTi, Glass, ABS, PA, PU
Viscosity, cPs: 600
Hardness: D80

Clear; fluorescing; needle bonder
Interfacial Cure Time*: 0.2 sec.
Key Substrates: ABS, SS, PC, PVC, Glass, PMMA, PA
Viscosity, cPs: 300
Hardness: D70

Clear; fluorescing; lower viscosity; fluorescing needle bonder
Interfacial Cure Time*: 0.2 sec.
Key Substrates: ABS, SS, PC, PVC, Glass
Viscosity, cPs: 200
Hardness: D75

Moisture resistant; fluorescing; adhesion to a variety of substrates
Interfacial Cure Time*: 0.2 sec.
Key Substrates: PC, PVC, ABS, PMMA, SS
Viscosity, cPs: 5,000
Hardness: D50

Clear; fluorescing; flexible PVC bonder
Interfacial Cure Time*: 0.2 sec.
Key Substrates: PVC, PC, PU, ABS, EVA
Viscosity, cPs: 10,000
Hardness: A55

Flexible; low shrinkage; moisture resistant; fluorescing
Interfacial Cure Time*: 0.2 sec.
Key Substrates: PC, PA, PMMA, PU, PVC, SS
Viscosity, cPs: 300
Hardness: D55

Clear; fluorescing; multipurpose adhesive for plastics and metals
Interfacial Cure Time*: 0.2 sec.
Key Substrates: PC, PVC, PU, ABS, SS
Viscosity, cPs: 150
Hardness: D70

Clear; fluorescing; general plastic bonder
Interfacial Cure Time*: 0.2 sec.
Key Substrates: PVC, PC, PU, ABS, PET
Viscosity, cPs: 450
Hardness: D55

See-Cure version; general purpose plastic bonder
Interfacial Cure Time*: 0.2 sec.
Key Substrates: PC, PVC, PU, ABS, PET
Viscosity, cPs: 600
Hardness: D60

Formulated with new Encompass™ technology that combines Dymax exclusive See-Cure color change and Ultra-Red™ fluorescing technologies with LED-curing capabilities; 385-405 nm LED light cure; ISO 10993-5 cytotoxicity; general purpose plastics and metal bonder
Interfacial Cure Time*: 0.2 sec.
Key Substrates: PC, PMMA, PS, ABS, stainless steel
Viscosity, cPs: 6,000
Hardness: D70

LED light cure 385 nm or 405 nm; Ultra-Red™ fluorescing; tack-free cure; medium viscosity; needle bonder
Interfacial Cure Time*: 0.4 sec.
Key Substrates: SS, PU, PC, PS, ABS, Glass, PA, PMMA, PP
Viscosity, cPs: 2,800
Hardness: D70

LED light cure 385 nm or 405 nm; blue fluorescing; low viscosity for improved wetting; resists yellowing; fast cure; needle bonder
Interfacial Cure Time*: 0.2 sec.
Key Substrates: SS, PC, PU, PS, ABS, PA, PMMA, PP
Viscosity, cPs: 150
Hardness: D70

LED light cure 385 nm or 405 nm; blue fluorescing; low viscosity for easy dispense; moisture resistant; tack-free cure; needle bonder
Interfacial Cure Time*: 0.2 sec.
Key Substrates: SS, PU, PC, PS, ABS, PA, PMMA, PP
Viscosity, cPs: 450
Hardness: D57

LED light cure 385 nm or 405 nm; Ultra-Red™ fluorescing; higher viscosity; low wicking; needle bonder
Interfacial Cure Time*: 0.2 sec.
Key Substrates: SS, PU, PC, PS, ABS, PA, PMMA, PP
Viscosity, cPs: 6,000
Hardness: D65

LED light cure 385 nm or 405 nm; formulated with Encompass™ technology; low viscosity for tight tolerance applications; deeper section cure; needle bonder
Interfacial Cure Time*: 3 sec.
Key Substrates: SS, PC, PMMA, FR4, ABS
Viscosity, cPs: 150
Hardness: D70

LED light cure 385 nm or 405 nm; formulated with Encompass™ technology; higher viscosity; deeper section cure; needle bonder
Interfacial Cure Time*: 3 sec.
Key Substrates: SS, PC, ABS, PMMA
Viscosity, cPs: 7,000
Hardness: D70

LED light cure 385 nm or 405 nm; blue fluorescing; low viscosity for improved wetting; resists yellowing; needle bonder
Interfacial Cure Time*: 0.2 sec.
Key Substrates: SS, PP, PE, ABS, PC, PEI, PETG, PMMA, PS, PVC
Viscosity, cPs: 150
Hardness: D70

Micro-circuit coating with secondary heat cure; flame retardant; solvent free; suitable for flexible and rigid substrates; repairable
Interfacial Cure Time*: 0.1 sec.
Key Substrates: CAP, PS, TPU, Glass, AL, Ceramic, Metal, FR-4, Glass-Filled Epoxy
Viscosity, cPs: 3,000
Hardness: A67
See-Cure version; excellent surface protection; easy peel off after exposure to heat; spray or dip
Interfacial Cure Time*: N/A
Key Substrates: Glass, Metals
Viscosity, cPs: 45,000
Hardness: D40

Excellent surface protection; high adhesion; easy peel off after hot-water soak; green color; sprayable
Interfacial Cure Time*: N/A
Key Substrates: Glass, Metals
Viscosity, cPs: 25,000
Hardness: D55

* Interfacial cure time is based on glass-to-glass bonding with the BlueWave LED DX-1000 (flood or spot mode) or the BlueWave LED Prime UVA; minimum intensity of 675 mW/cm2.