UV Potting Materials for Electronic Applications

Excellent Protection of Electronic Components and Circuitry

 

UV Light-Cure Potting Compounds for Electronic & Industrial Applications

Replace epoxy urethane and silicone with UV potting adhesives that cure tack free in seconds upon exposure to UV/Visible light. Shallow potting and sealing of electronic components and circuitry is possible in 10-30 seconds or less. Fast cure times allow for complete in-line processing, lower labor costs, and large throughput increases for J.I.T. manufacturing. The ability to cure with light eliminates the need for fixtures, jigs, racks, and ovens, increasing space and lowering total inventory costs.

Flexible UV potting adhesives are ideal for shallow potting and sealing of connectors, thermal switches, and sensors as well as for tamper proofing. They provide translucent bonds with excellent adhesion to engineered plastics. Multi-Cure® UV potting adhesives seal exposed areas with light, and cure secondarily with activator or heat for shadowed areas. They provide high adhesion to metals, glass, ceramic, and many thermoset plastics and are well suited for bridge bonding.

Halogen-Free Dymax Products Dymax has halogen-free formulations. We offer a wide variety of halogen-free coatings, adhesives, encapsulants, and potting materials.
Download  UV Curable Adhesives, Conformal Coatings and Encapsulants for Electronics Assembly Selector
Download  Dymax Light-Curing Equipment Selector Guide
Download  Dispensing Equipment Selector Guide

UV Light-Curable Potting Compounds Selector Guide

Applications: Component potting
Features: Urethane acrylate; light cure in seconds; secondary heat cure; one part, no mixing is required; multiple viscosities; visible light cure for maximum cure depth; adhesion to filled plastics including PBT/Valox®; halogen-free

Applications: Chip-on-board; chip-on-flex; multi-chip modules; chip-on-glass; wire bonding; bare die encapsulation
Features: Urethane acrylate; UV/Visible light cure for fastest processing; secondary heat cure for shadowed areas; optimal coverage; one part, so no mixing is required; solvent free, Isocyanate free; low Tg, low modulus for wire bonding; halogen-free; LED light-curable