Replace epoxy urethane and silicone with UV potting adhesives that cure tack free in seconds upon exposure to UV/Visible light. Shallow potting and sealing of electronic components and circuitry is possible in 10-30 seconds or less. Fast cure times allow for complete in-line processing, lower labor costs, and large throughput increases for J.I.T. manufacturing. The ability to cure with light eliminates the need for fixtures, jigs, racks, and ovens, increasing space and lowering total inventory costs.
Flexible UV potting adhesives are ideal for shallow potting and sealing of connectors, thermal switches, and sensors as well as for tamper proofing. They provide translucent bonds with excellent adhesion to engineered plastics. Multi-Cure® UV potting adhesives seal exposed areas with light, and cure secondarily with activator or heat for shadowed areas. They provide high adhesion to metals, glass, ceramic, and many thermoset plastics and are well suited for bridge bonding.
|Dymax has halogen-free formulations. We offer a wide variety of halogen-free coatings, adhesives, encapsulants, and potting materials.|
|UV Curable Adhesives, Conformal Coatings and Encapsulants for Electronics Assembly Selector|
|Dymax Light-Curing Equipment Selector Guide|
|Dispensing Equipment Selector Guide|