Halogen-Free Conformal Coatings, Adhesives, Encapsulants, & Potting Materials

Meet Industry Mandates Without Sacrificing Performance Requirements


Halogen-Free Conformal Coatings, Adhesives, Encapsulants, & Potting Materials

Halogen-Free Background

Halogen-Free Electronics Assembly Materials

Bromine and chlorine are known to emit toxic and corrosive gases when ignited. In 2003, standards created by the International Electromechanical Commission (IEC) were passed into law to eliminate concerns associated with end of life/disposal of devices containing these chemicals. Initial target areas include consumer electronics and household appliances.

The Dymax Documented Halogen-Free Program

Dymax Halogen-Free conformal coatings, encapsulants, potting compounds, and adhesives are documented by an independent laboratory to meet or exceed standards set forth in IEC 61249-2-21. This international directive defines halogen-free as <900 ppm for chlorine, <900 ppm for bromine and < 1500 ppm total level of both combined. The current test method used for certification is BS EN 14582:2007.

Dymax halogen-free formulations have been the global standard for many years. We offer a wide variety of halogen-free conformal coatings, adhesives, potting materials and more to meet industry mandates without sacrificing performance requirements.

Declared Halogen-Free Materials

ProductViscosity (nominal)Primary FeaturesLink to Report*
*Registration Required
Conformal Coatings
9481-E 125 cP Room temperature secondary moisture cure, enhanced chemical resistance Halogen-Free Report
9-20351-UR 13,500 cP High viscosity for selective application of thick coating optimized for wetting high-profile leads, Ultra-Red™ fluorescing, secondary heat cure for shadowed areas Halogen-Free Report
9-20557 2,700 cP Medium viscosity for coverage and high thermal shock performance Halogen-Free Report
9-20557-LV 800 cP Low viscosity version of 9-20557 for spray equipment compatibility Halogen-Free Report
984-LVUF 125 cP Rigid, low viscosity coating, high chemical resistance Halogen-Free Report
987 150 cP Thin, chemically resistant conformal coating, recommended for difficult-to-wet components and assembly materials Halogen-Free Report
Assembly Materials
921-GEL 25,000 cP Light cure potting resin, secondary heat cure, one part, no mixing is required, multiple viscosities, visible light cure for maximum cure depth, adhesion to filled plastics including PBT/Valox® Halogen-Free Report
921-T 3,500 cP Light cure potting resin, secondary heat cure, one part, no mixing is required, multiple viscosities, visible light cure for maximum cure depth, adhesion to filled plastics including PBT/Valox® Halogen-Free Report
921-VT 11,000 cP Light cure potting resin, secondary heat cure, one part, no mixing is required, multiple viscosities, visible light cure for maximum cure depth, adhesion to filled plastics including PBT/Valox® Halogen-Free Report
9001-E-v3.1 4,500 cP Multi-purpose adhesive, potting material & encapsulant Halogen-Free Report
9008 4,500 cP Flex circuit adhesive and encapsulant, thixotropic for precise dispensing on ICs, highly moisture resistant, low dielectric constant for high frequency applications, low modulus for minimal stress, remains flexible at low temperatures Halogen-Free Report
9422-SC 38,000 cP Light cure BGA, component/CSP reinforcement adhesive, See-Cure, highly thixotropic, BGA/VGA ruggedizing Halogen-Free Report
9622 12,000 cP LIGHT-CAP® LED casting resin, one part - no mixing required, heat resistant to 100°C, resistant to long term UV exposure, high light transmittance, durometer between silicone and epoxy Halogen-Free Report
9663 600 cP Light-cure keypad coating, low viscosity minimizes air entrapment, low outgassing, one part - no mixing required, high flexibility, resistant to yellowing, abrasion resistant Halogen-Free Report
9-318-F 50,000 cP Peelable maskant for electronics, highly thixotropic for manual or automated dispensing on difficult-to-mask areas, fluoresces for visual inspection, medium adhesion for easy removal Halogen-Free Report
9-911-REV-A 40,000 cP Wire tacking and coil termination adhesive for electronics, low shrinkage, one part - no mixing is required, does not contain silicone Halogen-Free Report
9-20479-B 150,000 cP Peelable maskant for electronics, highly thixotropic for manual or automated dispensing, blue color for visual inspection, medium adhesion for easy peeling Halogen-Free Report
9-20737 10,000 cP Display sealing adhesive, highly thixotropic for optimal product placement, one part - no mixing required, compatible with Dymax optical bonding adhesives, enhanced resistance to yellowing from heat or UV exposure Halogen-Free Report
9-20801 110,000 cP Thermal interface adhesive, thermally conductive, 0.9 W/m*K, light cure in seconds, secondary heat cure, highly thixotropic for optimal placement, visible light cure for maximum cure depth
*Coefficient of thermal conductivity
Halogen-Free Report