UV Light Curing Adhesives for Wire Tacking and Component Ruggedizing

Ruggedizing and Staking Materials Engineered to Hold Critical Components


UV Light Curing Adhesives for Wire Tacking and Component Ruggedizing

Dymax UV/Visible light cure adhesives cure in seconds to provide optimal circuit protection. The "on demand" cure feature of these resins makes them ideal for manual applications such as wire tacking and coil termination, where optimal placement and immediate strength is critical. Dymax component ruggedizing and staking materials are engineered to hold critical components, such as Ball Grid Arrays (BGA) and Video Graphics Arrays (VGA), for secondary processes or for long-term reliability. Each material helps enhance shock and vibration resistance of electronic assemblies.

UV potting resins reduce waste from off-ratio mixing and are free from isocyanates and heavy metals. Processing in seconds eliminates fixtures, jigs, racks, and ovens to increase space and lower total inventory costs. UV potting compounds are ideal for shallow component potting and sealing of connectors, inductors, detectors, capacitors, RF circuits, relay screws, sensors, tamper proofing, and PCB encapsulation.

Halogen-Free Dymax Products Dymax has halogen-free formulations. We offer a wide variety of halogen-free coatings, adhesives, encapsulants, and potting materials.
Download  Leadless Component Ruggedization Adhesives Sheet
Download  Ruggedizing Adhesives for Power Supply Components Application Bulletin
Download  UV Curable Adhesives, Conformal Coatings and Encapsulants for Electronics Assembly Selector
Download  Materials for Smart Connected Device Assembly Selector Guide
Download  Dymax Light-Curing Equipment Selector Guide
Download  Dispensing Equipment Selector Guide

Wire Tacking and Component Ruggedizing Adhesives Selector Guide

Applications: Reinforcing fine pitch or leadless components; underfill alternative; shock absorption
Features: Tack-free cure; compatible with both needle and jet dispensing equipment; adhesion to various PCB substrates; reduces stress on board components; highly thixotropic for minimal movement after dispense; See-Cure adhesives appear blue when dispensed and become clear for easy verification of cure; halogen-free

Applications: Reinforcing fine pitch or leadless components; underfill replacement; staking
Features: Fast, room-temperature cure; adhesion to various PCB substrates; low modulus for reducing stress on board components; highly thixotropic for minimal movement after dispense; See-Cure adhesives appear blue when dispensed and become clear for easy verification of cure; halogen-free

Applications: Wire tacking/coil termination
Features: On-demand cure for optimal positioning; easily dispensed by hand; exposed areas cure in seconds for immediate strength; shadowed areas may cure with heat over time; halogen-free