Dymax UV/Visible light cure adhesives cure in seconds to provide optimal circuit protection. The "on demand" cure feature of these resins makes them ideal for manual applications such as wire tacking and coil termination, where optimal placement and immediate strength is critical. Dymax component ruggedizing and staking materials are engineered to hold critical components, such as Ball Grid Arrays (BGA) and Video Graphics Arrays (VGA), for secondary processes or for long-term reliability. Each material helps enhance shock and vibration resistance of electronic assemblies.
UV potting resins reduce waste from off-ratio mixing and are free from isocyanates and heavy metals. Processing in seconds eliminates fixtures, jigs, racks, and ovens to increase space and lower total inventory costs. UV potting compounds are ideal for shallow component potting and sealing of connectors, inductors, detectors, capacitors, RF circuits, relay screws, sensors, tamper proofing, and PCB encapsulation.
|Dymax has halogen-free formulations. We offer a wide variety of halogen-free coatings, adhesives, encapsulants, and potting materials.|