Light-Curable Encapsulants for Microelectronic Assembly and IC Protection

Tough Flexible Encapsulants for Bare Die, Wire Bonds, or Integrated Circuits (IC)


Encapsulants for Microelectronic Assembly and IC Protection

Dymax Ultra Light-Weld® encapsulants cure in seconds upon exposure to UV and/or visible light to produce tough, flexible encapsulants for bare die, wire bonds, or integrated circuits (IC). The encapsulants' fast cure helps reduce processing and energy costs associated with alternative technologies. The materials are all one part, so no mixing is required and viscosity is consistent. Dymax encapsulating materials have high ionic purity, resistance to humidity and thermal shock which effectively protect components. These encapsulants contain no sharp, abrasive mineral or glass fillers which may abrade fine wires. Their combination of low Tg and low modulus translates into low stress for bonded wires.

Ultraviolet light curing resins are ideal for glob top and chip-on-board applications. They may also be used on flex circuits (FPC) for encapsulating ICs, coating the circuit or attaching it to glass or PCB. A wide range of viscosities, from thin wicking to non-flowing gel is available. Dymax LED Protection encapsulants are also available to enhance LED performance.

Halogen-Free Dymax Products Dymax has halogen-free formulations. We offer a wide variety of halogen-free coatings, adhesives, encapsulants, and potting materials.
Download  UV Curable Adhesives, Coatings and Encapsulants for Electronics Assembly Selector Guide
Download  Encapsulants for Electronics Assembly Selector Guide
Download  Dispensing Equipment Selection and Set-up Considerations for Dual-Cure Materials
Download  Materials for Smart Connected Device Assembly Selector Guide
Download  Dymax Light-Curing Equipment Selector Guide
Download  Dispensing Equipment Selector Guide

Light Curing Encapsulants for Microelectronic Assembly Selector Guide

Applications: Chip-on-board; chip-on-flex; multi-chip modules; chip-on-glass; wire bonding; bare die encapsulation
Features: UV/Visible light cure for fastest processing; secondary heat cure for shadowed areas; multiple viscosities available for optimal coverage; one part, so no mixing is required; solvent free, Isocyanate free; low Tg, low modulus for wire bonding; halogen-free; LED light-curable

Applications: Chip-on-flex encapsulation and flex circuit bonding/attachment
Features: Flexible; highly moisture-resistant bonds to diverse surfaces such as polyimide, DAP, glass, epoxy board, metal, and PET; high adhesion, even at -40°C; halogen-free

NEW! 9101
Applications: Chip-on-board; chip-on-flex; chip-on-glass; wire bonding
Features: UV/Visible light cure; secondary moisture cure; flexible encapsulant; shadowed area performance; moisture and thermal resistance; high CTE and low Tg for lower stress on components; halogen-free

NEW! 9102
Applications: Chip-on-board; chip-on-flex; chip-on-glass; wire bonding
Features: UV/Visible light cure; secondary moisture cure; flexible encapsulant; shadowed area performance; moisture and thermal resistance; high CTE and low Tg for lower stress on components; halogen-free

NEW! 9103
Applications: Chip on board; chip-on-flex; chip-on-glass; wire bonding
Features: UV/Visible light cure; secondary moisture cure; flexible encapsulant; shadowed area performance; moisture and thermal resistance; high CTE and low Tg for lower stress on components; halogen-free