Dual-Cure Light- and Moisture-Cure Technology

Conformal Coatings & Encapsulants

Dual-Cure Conformal Coatings and Encapsulants

Dual-Cure electronic conformal coating and encapsulant technology represents the newest advancement in light/moisture cure technology. Dymax Dual-Cure conformal coatings and encapsulants for printed circuit boards (PCB) and electronics assembly applications are specifically formulated to ensure complete cure in applications where shadowed areas on high-density circuit boards are a concern.

Previously, areas shadowed from light were managed by selective coating - eliminating the need to cure in shadowed areas or a secondary heat-cure process. Users needed to balance the cost of selective dispensing equipment and time/energy costs of a secondary heat cure.

Dual-Cure conformal coating and encapsulating materials enable shadowed areas on PCBs to cure over time with moisture, eliminating the need for that second process step or concerns of component life degradation due to temperature exposure. In addition, Dymax Dual-Cure products fluoresce bright blue when exposed to UV light and are easily dispensed. Read more regarding dispensing equipment selection and setup considerations for Dual-Cure materials.

Features of Dymax Dual-Cure Conformal Coatings & Encapsulants:

  • Solvent free
  • Ability to light cure in seconds allows for immediate processing
  • Faster secondary moisture cure than other conformal coatings and encapsulants
  • Bright blue fluorescence for easy Q.C. inspection
  • Chemically resistant
  • Good component wetting
  • Low concentration of free isocyanates
  • Enable greater output and lower assembly costs
  • RoHS Compliant

Dymax Dual-Cure Conformal Coatings & Encapsulants

Electrical Properties*PropertyValue†Test Method
Conformal Coatings » see all Conformal Coatings
9481-E Dielectric Constant (1 MHz) 3.90 ASTM D150
Dissipation Factor (1 MHz) 0.01 ASTM D150
Dielectric Strength, kV/mm [V/mil] >59 [>1,500] MIL-I-46058C
Volume Resistivity, ohm-cm 1.01 x 1016 ASTM D257
Surface Resistivity, ohm 3.92 x 1015 ASTM D257
9482 Dielectric Constant (1 MHz) 3.61 ASTM D150
Dissipation Factor (1 MHz) 0.03 ASTM D150
Dielectric Strength, kV/mm [V/mil] 43 [1,100] ASTM D149
Volume Resistivity, ohm-cm 1.63E+13 ASTM D257
Surface Resistivity, ohm 2.06E+12 ASTM D257
Encapsulants » see all Encapsulants
9101 Dielectric Constant (1 MHz) 3.11 ASTM D150
Dissipation Factor (1 MHz) 0.06 ASTM D150
Dielectric Strength, kV/mm [V/mil] 25.73 [654] ASTM D149
Volume Resistivity, ohm-cm 2.93E+13 ASTM D257
Surface Resistivity, ohm 2.52E+12 ASTM D257
9102 Dielectric Constant (1 MHz) 3.05 ASTM D150
Dissipation Factor (1 MHz) 0.06 ASTM D150
Dielectric Strength, kV/mm [V/mil] 25.87 [657] ASTM D149
Volume Resistivity, ohm-cm 4.89E+13 ASTM D257
Surface Resistivity, ohm 3.83E+12 ASTM D257
9103 Dielectric Constant (1 MHz) 2.80 ASTM D150
Dissipation Factor (1 MHz) 0.06 ASTM D150
Dielectric Strength, kV/mm [V/mil] 24.17 [614] ASTM D149
Volume Resistivity, ohm-cm 2.62E+13 ASTM D257
Surface Resistivity, ohm 3.53+12 ASTM D257

*Not Specifications    † Measured 100 hours after light cure