Activators for Industrial/Structural Adhesive Bonding Applications

Enable Curing of Acrylate Adhesives in Areas Not Able to See Light or Heat


Activators for Industrial/Structural Adhesive Bonding Applications

Adhesive activators are used to increase cure speed and improve adhesion of industrial adhesive bonding applications. Adhesive activators are designed to enable curing of 600 series and 800 series acrylate adhesives in areas not able to see light or heat. Dymax 600 series or 800 series metal bonding adhesives develop bond strengths up to 3,500 psi in 10 to 30 seconds between opaque surfaces when an adhesive activator is pre-applied to metal substrates. Many products also bond well to various engineering plastics and glass surfaces as well.

  • Increase strength of bonded substrates
  • Improve adhesion
  • Fixture in seconds

Structural adhesives form durable bonds with an adhesive activator between close-fitting parts for fast metal joining, ferrite bonding, magnet bonding, and motor assembly. Applications include tacking, bonding speaker cones, magnet bonding, motor assembly, furniture assembly, appliance manufacturing, plastic assembly, and general bonding to metal and ceramics.

Download  Guidelines for Activator Curing Dymax Multi-Cure Engineering Structural Adhesives
Download  Comprehensive Guide to Dymax UV Light Curing Technology
Download  Industrial Adhesives Product Selector Guide - Glass, Metal, and Plastic Assembly Adhesives

Adhesive Activators Selector Guide

Applications: Used with Dymax 600 and 800 series structural bonding adhesives and 9- series thermal interface adhesive for increasing bond strength to metal, plated metal, ceramic, and glass substrates
Features: Strong structural bonds; fixtures in 10-20 seconds; no solvent flash-off time

Applications: Used with Dymax 600 and 800 series structural bonding adhesives for fast structural bonding; high strength bonds form to metal, painted/coated metal, plated and surface treated metal, ferrite, ceramic, glass, wood, and thermoset plastic substrates
Features: ODC-free; strong structural bonds; excellent degreasing and wetting properties; allows cure speed to match assembly speed; variety of application techniques; elimination of heat curing and other delays in curing; on-part cleaning action; broad tolerance of adhesive-to-activator ratios; rapid, on-demand curing to fixture or handling strength allows in-line quality control and increased production thru-put