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Epoxy Resins |
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Epoxy resins are made of tightly linked adhesive polymer structures that are often used in surface adhesives and coatings. Epoxy resins are capable of forming tight cross-linked polymer structures characterized by toughness, strong adhesion, and low shrinkage. Epoxy adhesives are nearly unmatched in heat and chemical resistance.
When a two-part Crosslink® epoxy resin is mixed with the appropriate catalyst, the resulting reaction is exothermic, a chemical reaction that results in the release of heat. Crosslink and DYMAX epoxies are excellent for potting, casting, encapsulating, and a wide variety of structural bonding applications.
- One-part and two-part epoxy resin systems
- Electronic and structural applications
- Bond metal, glass, plastics, and ceramics
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Epoxy Adhesives Selector Guide |
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Click on the product number below for additional information. |
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| Epoxy Resin |
Application |
Features |
| DYMAX Epoxy Resin |
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| 8-20626 |
Bonds metal, glass, ceramic, thermoset plastics, and filled Nylon |
One-component epoxy resin; induction/heat cure; large gap cure
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| Crosslink® Epoxies |
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| Epoxies for Electronic Applications |
| ER2060/CT2060 |
Potting and encapsulation of coils, capacitors, chokes, resistors, transformers, and electronic assemblies |
General purpose epoxy resin; thermal and electrical insulation properties; room-temperature cure; thermal shock and impact resistance |
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| ER2116/CT63 |
Encapsulating, potting of transformers, coils, chokes, and solenoids |
Outstanding physical, thermal and electrical properties; moisture and chemical resistant |
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| ER2225/CT90 |
Thermally conductive encapsulating, potting, and casting of transformers, coils, chokes, solenoids, and micro circuitry |
Optimum physical, thermal, and electrical insulation properties |
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| ER2300/CT2300 |
High-temperature potting material and encapsulant with thermal shock and track resistance |
Excellent moisture and chemical resistance forms a hermetic-like seal to protect encapsulated parts |
| Epoxies for Structural Applications |
| ER1100/CT1100 |
Bonding glass, plastics, steel, aluminum, ceramics, and dissimilar substrates |
General purpose epoxy resin, high-strength, "5 minute" fast curing |
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| ER2994/CT614 |
Ideal for speaker cones, small area encapsulating |
Warm-air cure; solvent, chemical, moisture, and heat resistant; fast heat-curing with short working time |
| Epoxies for Plastic Applications |
| ER1100/CT1100 |
Bonding glass, plastics, steel, aluminum, ceramics, and dissimilar substrates |
General-purpose epoxy resin, high-strength, "5 minute" fast curing |
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| ER2116/CT63 |
Encapsulating, potting of transformers, coils, chokes, and solenoids |
Outstanding physical, thermal, and electrical properties; moisture and chemical resistant |
| Epoxies for Glass Applications |
| ER1100/CT1100 |
Bonding glass, plastics, steel, aluminum, ceramics, and dissimilar substrates |
General-purpose epoxy resin, high-strength, "5 minute" fast curing |
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| ER5000/CT5000 |
High clarity epoxy for glass bonding |
Crystal clear epoxy resin; low viscosity |
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| ER5030/CT5030 |
High clarity epoxy for LCD laminating/bonding; fiber-optic coupling |
Moisture resistant epoxy resin |
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Max says if you don't see an epoxy
resin that suits your application, call DYMAX Applications Engineering for a recommendation.
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