Thermal Interface Materials |
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DYMAX Multi-Cure® thermal interface materials may be cured with light, heat, or activator. Most applications utilize a combination of these methods for optimal cure speed. Light cure allows for exposed areas to cure immediately, fixturing parts in place so activator or heat can continue curing in shadowed areas without interruption to process flow.
DYMAX thermal interface materials offer thermal conductivity levels as high as
0.9 W/m*K. They are high viscosity and highly thixotropic for optimal dispensing and material placement.
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Thermal Interface Materials (TIM) Selector Guide |
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Click on the product number below for additional information. |
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| TIM |
Application |
Features |
| 9-20801 |
Thermal interface adhesive |
Thermally conductive; 0.9 W/m*K; UV/Visible light cure for exposed areas in seconds; activator or heat cure shadowed areas; one part; solvent free; halogen-free |
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| 501-E |
Activator |
Solvent-free activator; Low viscosity ideal for thin spray or brush applications |
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*Coefficient of thermal conductivity |
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Max says if you don't see an adhesive that suits your application, call DYMAX Applications Engineering
for a recommendation. We have a library of over 3,000 adhesive formulations to choose from!.
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