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UV Curing Resins for
Electronic & Industrial Potting Applications

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DYMAX light cure UV potting materials cure tack free in seconds upon exposure to UV/Visible light. Each potting material is engineered to bond different substrates, offering tenacious adhesion to plastics and metals. DYMAX LED Protection potting materials are also available to enhance LED performance.

UV potting resins reduce waste from off-ratio mixing and are free from isocyanates and heavy metals. Processing in seconds eliminates fixtures, jigs, racks, and ovens to increase space and lower total inventory costs. The materials are ideal for shallow potting and sealing of connectors, inductors, detectors, capacitors, RF circuits, relay screws, sensors, tamper proofing, and PCB encapsulation.

Halogen-Free DYMAX Products DYMAX also has halogen-free potting materials available. We offer a wide variety of halogen-free conformal coatings, adhesives, encapsulants, and potting materials.

UV Curable Adhesives, Conformal Coatings and Potting Materials for Electronic Materials Assembly Selector GuideDownload our UV Curable Adhesives, Conformal Coatings and Potting Materials for Electronic Materials Assembly Selector Guide (417 KB)

All DYMAX adhesives are RoHS compliant Electronic & Industrial UV POTTING Resins Selector Guide

Click on the product number below for additional information.

Potting Resin Application Features
New! 9440
Halogen-Free Material
Potting UV silicone; fast tack-free cure; >90 day working life; low durometer; high depth of cure; ambient temperature cure; low glass transition temperature (Tg); superior performance in thermal excursions; high chemical resistance; solvent free
»Recommended for use with the BlueWave® LED Prime UVA Spot Curing System

921 Series
Halogen-Free Material
Potting Urethane acrylate; light cure in seconds; secondary heat cure; one part, no mixing is required; multiple viscosities; visible light cure for maximum cure depth; adhesion to filled plastics including PBT/Valox®; halogen-free

9001 E-V3 Series
Halogen-Free Material
Chip-on-board; chip-on-flex; multi-chip modules; chip-on-glass; wire bonding; bare die encapsulation Urethane acrylate; UV/Visible light cure for fastest processing; secondary heat cure for shadowed areas; multiple viscosities available for optimal coverage; one part, so no mixing is required; solvent free, Isocyanate free; low Tg, low modulus for wire bonding; halogen-free
»Recommended for use with the BlueWave® LED Prime UVA Spot Curing System
Crosslink® Epoxies for Potting Application Features
ER2060/CT2060 Potting and encapsulation of coils, capacitors, chokes, resistors, transformers, and electronic assemblies General purpose epoxy resin; thermal and electrical insulation properties; room-temperature cure; thermal shock and impact resistance

Max says if you don't see an adhesive that suits your application, call DYMAX Applications Engineering
for a recommendation. We have a library of over 3,000 adhesive formulations to choose from!

Max says if you don't see an adhesive that suits your application, call DYMAX Applications Engineering for a recommendation. We have a library of over 3,000 adhesive formulations to choose from!


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