Halogen-Free Conformal Coatings, Adhesives, Encapsulants, & Potting Materials

Halogen-Free Background

Bromine and chlorine are known to emit toxic and corrosive gases when ignited. In 2003, standards created by the International Electromechanical Commission (IEC) were passed into law to eliminate concerns associated with end of life/disposal of devices containing these chemicals. Initial target areas include consumer electronics and household appliances.

The DYMAX Documented Halogen-Free Program

DYMAX Halogen-Free conformal coatings, encapsulants, potting compounds, and adhesives are documented by an independent laboratory to meet or exceed standards set forth in IEC 61249-2-21. This international directive defines halogen-free as <900 ppm for chlorine, <900 ppm for bromine and < 1500 ppm total level of both combined. The current test method used for certification is BS EN 14582:2007.

DYMAX halogen-free formulations have been the global standard for many years. We offer a wide variety of halogen-free conformal coatings, adhesives, potting materials and more to meet industry mandates without sacrificing performance requirements.

Declared Halogen-Free Conformal Coatings

Product	Viscosity (nominal)	Primary Features	Link to Report Registration Required
9481	125 cP	Room temperature secondary moisture cure, enhanced chemical resistance
9-20351-UR	14,500 cP	High viscosity for selective application of thick coating optimized for wetting high profile leads, Ultra-Red™ Fluorescing, secondary heat cure for shadowed areas
9-20557	2,700 cP	Medium viscosity for coverage and high thermal shock performance
9-20557-LV	800 cP	Low viscosity version of 9-20557 for spray equipment compatibility
984-LVUF	125 cP	Rigid, low viscosity coating, high chemical resistance
987	150 cP	Thin, chemically resistant conformal coating, recommended for difficult-to-wet components and assembly materials

Declared Halogen-Free Assembly Materials

Product	Viscosity (nominal)	Primary Features	Link to Report Registration Required
921-Gel	25,000 cP	Light cure potting resin, secondary heat cure, one part, no mixing is required, multiple viscosities, visible light cure for maximum cure depth, adhesion to filled plastics including PBT/Valox®
921-T	3,500 cP	Light cure potting resin, secondary heat cure, one part, no mixing is required, multiple viscosities, visible light cure for maximum cure depth, adhesion to filled plastics including PBT/Valox®
921-VT	11,000 cP	Light cure potting resin, secondary heat cure, one part, no mixing is required, multiple viscosities, visible light cure for maximum cure depth, adhesion to filled plastics including PBT/Valox®
9001-E-v3.1	4,500 cP	Multi-purpose adhesive, potting material & encapsulant
9001-E-v3.5	17,000 cP	Multi-purpose adhesive, potting material & encapsulant
9001-E-v3.7	50,000 cP	Multi-purpose adhesive, potting material & encapsulant
9008	4,500 cP	Flex circuit adhesive and encapsulant, thixotropic for precise dispensing on ICs, highly moisture resistant, low dielectric constant for high frequency applications, low modulus for minimal stress, remains flexible at low temperatures
9440	1,000 cP	UV silicone firm gel for potting, fast tack-free cure, high depth of cure, ambient temperature cure, superior performance in thermal excursions, high chemical resistance
9422-SC	38,000 cP	Light cure BGA, component/CSP reinforcement adhesive, See-Cure, highly thixotropic, BGA/VGA ruggedizing
9622	12,000 cP	LIGHT-CAP® LED casting resin, one part - no mixing required, heat resistant to 100°C, resistant to long term UV exposure, high light transmittance, durometer between silicone and epoxy
9-318-F	50,000 cP	Peelable maskant for electronics, highly thixotropic for manual or automated dispensing on difficult-to-mask areas, fluoresces for visual inspection, medium adhesion for easy removal
9-911 Rev A	40,000 cP	Wire tacking and coil termination adhesive for electronics, low shrinkage, one part - no mixing is required, no VOC, does not contain silicone
9-20479-B	150,000 cP	Peelable maskant for electronics, highly thixotropic for manual or automated dispensing, blue color for visual inspection, medium adhesion for easy peeling
9-20737	11,000 cP	Display sealing adhesive, highly thixotropic for optimal product placement, one part - no mixing required, compatible with DYMAX optical bonding adhesives, enhanced resistance to yellowing from heat or UV exposure
9-20801	110,000 cP	Thermal interface adhesive, thermally conductive, 1.2 W/m*K, light cure in seconds, secondary heat cure, highly thixotropic for optimal placement, visible light cure for maximum cure depth *Coefficient of thermal conductivity