UV Light Curing Adhesives for
Wire Tacking and Component Ruggedizing |
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DYMAX UV/Visible light cure adhesives cure in seconds to provide optimal circuit protection. The "on demand" cure feature of these resins makes them ideal for manual applications such as wire tacking and coil termination, where optimal placement and immediate strength is critical. DYMAX component ruggedizing and staking materials are engineered to hold critical components, such as Ball Grid Arrays (BGA) and Video Graphics Arrays (VGA), for secondary processes or for long-term reliability. Each material helps enhance shock and vibration resistance of electronic assemblies.
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WIRE TACKING and COMPONENT RUGGEDIZING Adhesives Selector Guide |
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Click on the product number below for additional information. |
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| Electronic Adhesive |
Application |
Features |
| 9422-SC |
Reinforcing fine pitch or leadless components; underfill replacement; staking |
Fast, room-temperature cure; adhesion to various PCB substrates; low modulus for reducing stress on board components; highly thixotropic for minimal movement after dispense; See-Cure adhesives appear blue when dispensed and become clear for easy verification of cure. |
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| 9-911 Rev A |
Wire tacking/coil termination |
On-demand cure for optimal positioning; easily dispensed by hand; exposed areas cure in seconds for immediate strength; shadowed areas may cure with heat over time |
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| 9-20474-Gel |
Wire tacking; component ruggedizing; bonding jumper wires; PCB repair |
Highly thixotropic for optimal placement and wetting of components; ideal for staking prior to reflow |
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Max says if you don't see a wire tacking or component ruggedizing adhesive that suits your application, call DYMAX Applications Engineering
for a recommendation. We have a library of over 3,000 adhesive formulations to choose from!
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