Encapsulants for Microelectronic Assembly
and IC Protection |
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Dymax Ultra Light-Weld® encapsulants cure in seconds upon exposure to UV and/or visible light to produce tough, flexible encapsulants for bare die, wire bonds, or integrated circuits (IC). The encapsulants' fast cure helps reduce processing and energy costs associated with alternative technologies. The materials are all one part, so no mixing is required and viscosity is consistent. Dymax encapsulating materials have high ionic purity, resistance to humidity and thermal shock which effectively protect components. These encapsulants contain no sharp, abrasive mineral or glass fillers which may abrade fine wires. Their combination of low Tg and low modulus translates into low stress for bonded wires.
Ultraviolet light curing resins are ideal for glob top and chip-on-board applications. They may also be used on flex circuits (FPC) for encapsulating ICs, coating the circuit or attaching it to glass or PCB. A wide range of viscosities, from thin wicking to non-flowing gel is available. Dymax
LED Protection encapsulants are also available to enhance LED performance.
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Dymax also has halogen-free encapsulants
available. We offer a wide variety of halogen-free conformal coatings,
adhesives, encapsulants, and potting materials. |
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Light Curing ENCAPSULANTS for
Microelectronic Assembly Selector Guide |
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Click on the product number below for additional information. |
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| Encapsulant |
Application |
Features |
| 9001-E-v3.1 |
Chip-on-board; chip-on-flex; multi-chip modules; chip-on-glass; wire bonding; bare die encapsulation |
UV/Visible light cure for fastest processing; secondary heat cure for shadowed areas; multiple viscosities available for optimal coverage; one part, so no mixing is required; solvent free, Isocyanate free; low Tg, low modulus for wire bonding;
halogen-free
»Recommended for use w/ BlueWave® LED Prime UVA |
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| 9008 |
Chip-on-flex encapsulation and flex circuit bonding/attachment |
Flexible; highly moisture-resistant bonds to diverse surfaces such as polyimide, DAP, glass, epoxy board, metal, and PET; high adhesion, even at -40°C; halogen-free |
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| NEW! 9101 |
Chip-on-board; chip-on-flex; chip-on-glass; wire bonding |
UV/Visible light cure; secondary moisture cure; flexible encapsulant; shadowed area performance; moisture and thermal resistance; high CTE and low Tg for lower stress on components; halogen-free |
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| NEW! 9102 |
Chip-on-board; chip-on-flex; chip-on-glass; wire bonding |
UV/Visible light cure; secondary moisture cure; flexible encapsulant; shadowed area performance; moisture and thermal resistance; high CTE and low Tg for lower stress on components; halogen-free |
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| NEW! 9103 |
Chip on board; chip-on-flex; chip-on-glass; wire bonding |
UV/Visible light cure; secondary moisture cure; flexible encapsulant; shadowed area performance; moisture and thermal resistance; high CTE and low Tg for lower stress on components; halogen-free |
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Max says if you don't see an adhesive that suits your application, call Dymax Applications Engineering for a recommendation.
We have a library of over 3,000 adhesive formulations to choose from!
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