Encapsulants for Microelectronic Assembly
and IC Protection

DYMAX Ultra Light-Weld^® encapsulants cure in seconds upon exposure to UV and/or visible light to produce tough, flexible encapsulants for bare die, wire bonds, or integrated circuits (IC). The fast cure helps reduce processing and energy costs associated with alternative technologies. The materials are all one part, so no mixing is required and viscosity is consistent. DYMAX encapsulating materials have high ionic purity, resistance to humidity and thermal shock which effectively protect components. These encapsulants contain no sharp, abrasive mineral or glass fillers which may abrade fine wires. Their combination of low T_g and low modulus translates into low stress for bonded wires.

Ultraviolet light curing resins are ideal for glob top and chip-on-board applications. They may also be used on flex circuits (FPC) for encapsulating ICs, coating the circuit or attaching it to glass or PCB. A wide range of viscosities, from thin wicking to non-flowing gel is available. DYMAX LED Protection encapsulants are also available to enhance LED performance.

DYMAX also has halogen-free encapsulants available. We offer a wide variety of halogen-free conformal coatings, adhesives, encapsulants, and potting materials.

	Download our Encapsulants for Electronics Assembly Selector Guide (151 KB)
	Download our UV Curable Adhesives, Conformal Coatings and Encapsulants for Electronic Materials Assembly Selector Guide (460 KB)

Max says if you don't see an adhesive that suits your application, call DYMAX Applications Engineering for a recommendation. We have a library of over 3,000 adhesive formulations to choose from!