ENCAPSULANTS for Microelectronic Assembly

Tough, flexible UV light curing encapsulants cure in seconds and cut costs and processing times associated with microelectronic assembly. DYMAX 9000 Series encapsulating materials have high ionic purity, excellent adhesion, and resistance to humidity and thermal shock to effectively protect components. These encapsulants contain no sharp, abrasive mineral or glass fillers to abrade fine wires, and their combination of low T_g and low modulus means low stress. Ultraviolet light curing resins are ideal for glob top and chip on board applications and are especially suited for encapsulating IC’s in flex circuits. Clear and black grades are available along with a wide range of viscosities, from thin wicking to non-flowing gel.

Download our Encapsulants for Electronics Assembly Selector Guide (151 KB)

Download our UV Curable Adhesives, Conformal Coatings and Encapsulants for Electronic Materials Assembly Selector Guide (460 KB)

Selector Guide (CLICK ON the encapsulant product number to register to download a PDF version of the Product Data Sheet)

Glob top applications

Black encapsulants

Encapsulants for
flex circuits

Encapsulating LEDs

Max says if you don't see an adhesive that suits your application, call DYMAX Applications Engineering for a recommendation.
We have a library of over 3,000 adhesive formulations to choose from!