| Conformal Coating |
Applications |
Conformal Coating Features |
| Dual Cure - UV Light & Moisture Cure (UV/Moisture) |
NEW!
9481
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Formulated to ensure complete cure in applications where shadowed areas on
high density circuit boards are a concern; Fluoresces vivid blue when exposed to
UV light |
UV/visible light curing; secondary moisture cure for shadowed areas; low odor; bright blue fluorescing; chemically resistant;
MIL-I-46058-C, IPC-CC-830B & UL 94 Flammability pending |
| Light Curing |
| 984-LVUF |
Highly fluorescing for easy inspection; for densely populated circuit boards requiring shadow cure |
Hard; clear; fluorescing, environmentally resistant; tack-free surface; IPC UL and MIL Spec approved; moderately low viscosity; cures by UV light and secondarily with heat |
| 9-984-B |
Formulated for rapid room temperature cure when exposed to UV/visible light; excellent for hiding components and board features |
Hard; black; thin; low-gloss protective coating; adheres well to a variety of metal, ceramic and glass-filled epoxy surfaces |
| 9-986-F |
Formulated for maximum flexibility at low temperatures; easily penetrated by sharp electronic probes; easy re-work |
Flexible; single component; 100% solids; fluorescing; excellent adhesion to a variety of metal, ceramic and glass-filled epoxy surfaces; low viscosity |
| 9-984-LVF |
In-line curing up to 10 meters/minute |
Very fast curing; hard; glossy; fluorescing; 100% solids; retains a relatively high brilliant fluorescence after curing and will not fade |
| 9-20557 |
Forms tough, clear circuit encapsulant upon exposure to longwave UV/visible light; excellent for encapsulating, potting, sealing and bonding |
Flexible; resists yellowing, vibration, impact and thermal shock; excellent adhesion to most soldermasks and PCB materials; fluorescing; secondary heat cure capability; recommended for use with no-clean solder flux |
| 9-20676 |
Forms tough clear coating upon exposure to longwave UV/visible light; excellent for encapsulating, potting, sealing and bonding |
Performs well through vibration, impact and thermal shock testing; exhibits excellent adhesion to most solder masks; secondary heat cure capability |