UV Curing Encapsulants for
Automotive Microelectronics Assembly

Tough, flexible UV light curing encapsulants for automotive microelectronics assembly cure in seconds and cut the costs and processing times associated with microelectronic assembly. DYMAX 9000 Series UV curing encapsulating materials have high ionic purity, excellent adhesion, and resistance to humidity and thermal shock to effectively protect components. These encapsulants contain no sharp, abrasive mineral or glass fillers to abrade fine wires, and their combination of low T_g and low modulus means low stress.  Ultraviolet light curing encapsulants are ideal for glob top and chip on board applications and are especially suited for encapsulating IC’s in flex circuits. Optically clear and black grades of encapsulants are available along with a wide range of viscosities, from thin wicking to non-flowing gel.

Download our Chip Encapsulants for Superior Protection on Flexible and Rigid Platforms Selector Guide (151 kb)

Selector Guide (CLICK ON the encapsulant product number to register to download a PDF version of the Product Data Sheet)

Encapsulants for
glob top
applications

Black encapsulants

Encapsulants for
flex circuits

Encapsulating LEDs

Max says if you don't see an adhesive that suits your application, call DYMAX Applications Engineering
 for a recommendation. We have a library of over 3,000 adhesive formulations to choose from!