Product |
Applications |
Features |
| Dual Cure - UV Light & Moisture Cure (UV/Moisture) |
NEW!
9481
Learn more... |
Formulated to ensure complete cure in applications where shadowed areas on
high density circuit boards are a concern; Fluoresces vivid blue when exposed to
UV light |
UV/visible light curing; secondary moisture cure for shadowed areas; low odor; bright blue fluorescing; chemically resistant;
MIL-I-46058-C, IPC-CC-830B & UL 94 Flammability pending |
| Light Curing |
| 984-LVUF |
Densely populated circuit boards requiring shadow cure |
Hard; clear; fluorescing for easy inspection; environmentally resistant; tack-free surface; UL and MIL Spec approved; moderately low viscosity; cures by UV light and secondarily with heat |
| 9-984-B |
Hiding components and board features |
Hard; black; thin; low-gloss protective coating; adheres well to a variety of metal, ceramic and glass-filled epoxy surfaces; formulated for rapid room temperature cure when exposed to UV/visible light |
| 9-986-F |
Densely populated circuit boards requiring shadow cure |
Flexible; single component; 100% solids; fluorescing; excellent adhesion to a variety of metal, ceramic and glass-filled epoxy surfaces; low viscosity; formulated for rapid room temperature cure when exposed to UV/visible light; easily penetrated by sharp electronic probes |
| 9-984-LVF |
Densely populated circuit boards requiring shadow cure |
Very fast curing; hard; glossy; fluorescing; excellent adhesion to a variety of metal, ceramic and glass filled epoxy surfaces; single component; 100% solids; retains a relatively high brilliant fluorescence after curing and will not fade; high speed production for rapid room temperature cure when exposed to long wave UV light |
NEW!
987 |
Highly fluorescing conformal coating for rapid room temperature cure when exposed to UV and/or visible light; shadowed areas on densely populated circuit boards may be cured with heat; dispenses easily and cures quickly for precise quantity and placement |
Fluorescing; secondary heat cure; hard; environmentally resistant; meets MIL-I-46058C and IPC-CC-830B requirements |
| 9-20557 |
Encapsulating, potting, sealing and bonding |
Flexible; resists yellowing, vibration, impact and thermal shock; excellent adhesion to most soldermasks and PCB materials; fluorescing; secondary heat cure capability; forms tough, clear circuit encapsulant upon exposure to longwave UV/visible light |
| 9-20676 |
Encapsulating, potting, sealing and bonding |
Flexible; resists yellowing, vibration, impact and thermal shock; excellent adhesion to most soldermasks and PCB materials; fluorescing; secondary heat cure capability; forms tough, clear circuit encapsulant upon exposure to longwave UV/visible light |