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ER2994/CT614: Fast Solvent, Moisture,
and Heat Resistant 2-Part Potting Epoxy |
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Crosslink® ER2994/CT614 2-part potting epoxy resin adhesive is a 100% solids formulation for fast general bonding and small potting/encapsulation applications. This cured epoxy resin has excellent moisture, solvent, and heat resistance. ER2994/CT614 resin system provides high levels of toughness and adheres to most plastics with little or no surface preparation. Thin coatings can cure in 45 seconds at 65°C [150°F]. This epoxy should not be used for curing large volumes due to excessive exotherm in mass. Recommended substrates include polycarbonate, polycarbonate/ABS, polyetherimide, and PETG. Typical applications include electronic encapsulation, electrical component sealing, general bonding, and small encapsulation and potting.
Viscosity
(nominal) | Durometer Hardness |
Tensile at Break, MPa [psi] | Package Sizes Available |
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| Mixed: 25,000 | D90 | 54 [3,900] | 50 mL 10:1 Cartridge |
| Features |
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- Fast cures
- Excellent solvent resistance
- Excellent moisture resistance
- Excellent heat resistance
- Good adhesion to most plastics
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| Applications |
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- Electronic encapsulation
- Electrical component sealing
- General bonding
- Small encapsulation and potting
- Recommended substrates include polycarbonate, polycarbonate/ABS, polyetherimide, and PETG
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Max says if you don't see an epoxy
resin that suits your application, call DYMAX Applications Engineering for a recommendation.
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