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ER2060/CT2060: Low Shrink, Impact
Resistance, Room Temperature Curing
2-Part Epoxy |
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Crosslink® ER2060/CT2060 2-part epoxy resin adhesive is a 100% solids formulation designed to meet the most critical electronic requirements. This two-part, medium viscosity epoxy adhesive system is designed for ease in handling. ER2060/CT2060 cures at room temperature or with mild heat to exhibit outstanding physical, thermal, and electrical-insulation properties. This unique epoxy resin system has low shrinkage, high-tensile, and compressive strength as well as excellent thermal shock and impact resistance. ER2060/CT2060 epoxy system is recommended for encapsulation and potting of coils, capacitors, chokes, resistors and solenoids, transformers, rectifiers, and electronic assemblies. This epoxy resin system shows excellent adhesion to plastics, FR4, and metals for potting.
Viscosity
(nominal) | Durometer Hardness | Tensile at Break, MPa [psi] | Package Sizes Available |
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resin: 20,000 cP
catalyst: 7,800 cP
mixed: (nominal) | D80 | 23 [3,400] | Quart Can
Gallon Can
5 Gallon Pail |
| Features |
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- 2-part low heat or room temperature cure
- Outstanding thermal and electrical insulation
- Low shrinkage
- Excellent thermal shock resistance
- Void-free potting
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| Applications |
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- Electronic encapsulation
- Electrical component sealing
- Recommended substrates include plastics, FR4, and metals for potting
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Max says if you don't see an epoxy
resin that suits your application, call DYMAX Applications Engineering for a recommendation.
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