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See-Cure 9422-SC:
Light Cure BGA, CSP Reinforcement Adhesive |
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Ultra Light-Weld® 9422-SC adhesive is designed for rapid bonding and reinforcing components on printed circuit boards. It also offers high adhesion to electronic components and circuit boards making it ideal for component staking and ruggedizing.
9422-SC provides rapid bonding to lead frame, PCB, silicon, and ceramic. DYMAX adhesives formulated with
See-Cure color-change technology appear bright blue in their uncured state, making them very visible when dispensed onto substrates. The color changes from blue to clear upon cure.
| Viscosity | Uncured Appearance | Substrates | Package Sizes Available |
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| 37,500 cP nominal | Blue Transparent Gel | Lead Frame
Ceramic
PCB
Silicon | 10 mL Syringe (MR)
30 mL Syringe (MR)
170 mL Cartridge
300 mL Cartridge |
| Features |
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- UV/Visible light cure
- Halogen-free
- Solvent free
- Blue to clear upon exposure to UV/Visible light
- No VOC
- One part, no mixing required
- Room temperature cure in seconds
- Adhesion to various PCB substrates
- Reduces stress on board components
- Highly thixotropic for minimal movement after dispense
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| Applications |
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- Reinforcing fine pitch or leadless components
- Shock absorption
- Underfill replacement
- Component staking
- Wire tacking
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DYMAX materials are solvent free and cure upon exposure to light. Their
ability to cure in seconds results in lower processing costs. When cured with DYMAX UV light curing spot lamps, focused beam lamps, or flood lamps, they deliver optimum speed and performance for maximum efficiency. DYMAX lamps offer the optimum balance of UV and visible light for the fastest, deepest cures. This product is in full compliance with the
RoHS Directives 2002/95/EC and 2003/11EC.
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Max says if you don't see an adhesive that suits your application, call DYMAX Applications Engineering for a recommendation.
We have a library of over 3,000 adhesive formulations to choose from!
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