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9008: Ultra Light-Weld®
UV Cure Flex Circuit
Adhesive & Encapsulant |
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Ultra Light-Weld® 9008 cures upon exposure to UV and/or visible light and is designed for rapid chip encapsulation on flexible printed circuits (FPC). DYMAX 9008 has tenacious adhesion to polyimide (Kapton®), while maintaining flexibility. It is engineered for chip encapsulation on flex circuits. This product is thixotropic, allowing for easy formation of a protective encapsulant layer. It has a low dielectric constant and for high frequency applications. It may be used in attaching FPCs to various substrates including PCB and glass.
| Viscosity | Cured Appearance |
Substrates | Package Sizes Available |
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| 4,500 cP nominal | Clear | Ceramic
Leadframe
PCB
Flex
Silicon | 10 mL Syringe (MR)
30 mL Syringe (MR)
170 mL Cartridge |
| Features |
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- Halogen-free
- UV/Visible light cure
- One part, no mixing is required
- No VOC
- Solvent free, Isocyanate free
- Thixotropic for precise dispensing on ICs
- Highly moisture resistant
- Low dielectric constant for high frequency applications
- Low modulus for minimal stress
- Remains flexible at low temperatures
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| Applications |
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- Flex circuit bonding/attachment
- Chip-on-flex
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DYMAX materials are solvent free
and cure upon exposure to light. Their ability to cure in seconds results in lower
processing costs. When cured with DYMAX UV light curing spot lamps, focused beam lamps, or flood lamps, they deliver optimum speed and performance for maximum efficiency. DYMAX lamps offer the optimum balance of UV and visible light for the fastest, deepest cures. This product is in full compliance with the
RoHS Directives 2002/95/EC and 2003/11EC.
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Max says if you don't see a
material that suits your application, call DYMAX Applications Engineering for a recommendation.
We have a library of over 3,000 formulations to choose from!
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