9001-E-v3.1: Multi-Cure^®
UV Cure Encapsulant & Potting Resin

Multi-Cure^® 9001-E-v3.1 encapsulant cures in seconds to enhance moisture, thermal cycle, and abrasion resistance of electronic and microelectronic assemblies. This material offers adhesion to various component substrates. This encapsulant provides optimal coverage over difficult circuit geometries. 9001-E-v3.1 encapsulating material has high ionic purity, is solvent free, and isocyanate free. This encapsulant has been engineered to have a low modulus and low T_g to minimize stress on delicate wire bonds. Material exposed to light will cure in seconds, while any shadowed areas will cure upon heat exposure. 9001-E-v3.1 Visible/UV light-curable encapsulant is formulated for fast on-demand cure with the DYMAX BlueWave^® LED Prime UVA spot curing lamp.

Multi-Cure^® 9001-E-v3.1 encapsulant is especially well suited for chip-on-board, chip-on-flex, multi-chip modules and wire bonding.

	Download the 9001-E-v3.1 Product Data Sheet
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	9001-E-v3.1 Halogen-Free report (Registration required)

DYMAX materials are solvent free and cure upon exposure to light. Their ability to cure in seconds results in lower processing costs. When cured with DYMAX light curing spot lamps, focused beam lamps, or flood lamps, they deliver optimum speed and performance for maximum efficiency. DYMAX lamps offer the optimum balance of UV and visible light for the fastest, deepest cures. This product is in full compliance with the RoHS Directives 2002/95/EC and 2003/11EC.

Max says if you don't see a material that suits your application, call DYMAX Applications Engineering for a recommendation. We have a library of over 3,000 formulations to choose from!