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New! Dual-Cure Light- and Moisture-Cure Technology |
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Dual-Cure electronic conformal
coating and encapsulant technology represents the newest advancement in light/moisture cure technology. Dymax Dual-Cure conformal coatings
and encapsulants for printed circuit boards (PCB) and electronics
assembly applications are specifically formulated to ensure complete cure in
applications where shadowed areas on high-density circuit boards are
a concern.
Previously, areas shadowed from light were managed by selective
coating - eliminating the need to cure in shadowed areas or a secondary heat-cure process. Users needed to balance the cost of selective dispensing
equipment and time/energy costs of a secondary heat cure.
Dual-Cure conformal coating and encapsulating materials enable shadowed areas on PCBs to cure over time with moisture, eliminating the need for that second process step or concerns of component life degradation due to temperature exposure. In addition, Dymax Dual-Cure products fluoresce
bright blue when exposed to UV light and are easily dispensed. Read more regarding dispensing equipment selection and setup considerations for Dual-Cure materials.
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Features of Dymax Dual-Cure Conformal Coatings & Encapsulants:
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Solvent free |
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Ability to light cure in seconds allows for immediate processing |
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Faster secondary moisture cure than other conformal coatings and encapsulants |
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Bright blue fluorescence for easy Q.C. inspection |
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Chemically resistant |
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Good component wetting |
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Low concentration of free isocyanates |
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Enable greater output and lower assembly costs |
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RoHS Compliant
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Dymax Dual-Cure Conformal Coatings & Encapsulants
Click on product numbers below for additional properties, features, applications, and product data sheets
Conformal Coating | Electrical Properties* |
| Property | Value† | Test Method |
| 9481-E |
| Dielectric Constant (1 MHz) |
3.90 |
ASTM D150 |
| Dissipation Factor (1 MHz) | 0.01 |
ASTM D150 |
| Dielectric Strength, kV/mm [V/mil] |
>59 [>1,500] |
MIL-I-46058C |
| Volume Resistivity, ohm-cm |
1.01 x 1016 |
ASTM D257 |
| Surface Resistivity, ohm |
3.92 x 1015 |
ASTM D257 |
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| 9482 |
| Dielectric Constant (1 MHz) |
3.61 |
ASTM D150 |
| Dissipation Factor (1 MHz) | 0.03 |
ASTM D150 |
| Dielectric Strength, kV/mm [V/mil] |
43 [1,100] |
ASTM D149 |
| Volume Resistivity, ohm-cm |
Pending |
ASTM D257 |
| Surface Resistivity, ohm |
Pending |
ASTM D257 |
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*Not Specifications † Measured 100 hours after light cure
| Encapsulant | Electrical Properties* |
| Property | Value | Test Method |
| 9101 |
| Dielectric Constant (1 MHz) |
3.11 |
ASTM D150 |
| Dissipation Factor (1 MHz) | 0.06 |
ASTM D150 |
| Dielectric Strength, kV/mm [V/mil] |
25.73 [654] |
ASTM D149 |
| Volume Resistivity, ohm-cm |
2.93E+13 |
ASTM D257 |
| Surface Resistivity, ohm |
2.52E+12 |
ASTM D257 |
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| 9102 |
| Dielectric Constant (1 MHz) |
3.05 |
ASTM D150 |
| Dissipation Factor (1 MHz) | 0.06 |
ASTM D150 |
| Dielectric Strength, kV/mm [V/mil] |
25.87 [657] |
ASTM D149 |
| Volume Resistivity, ohm-cm |
4.89E+13 |
ASTM D257 |
| Surface Resistivity, ohm |
3.83E+12 |
ASTM D257 |
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| 9103 |
| Dielectric Constant (1 MHz) |
2.80 |
ASTM D150 |
| Dissipation Factor (1 MHz) | 0.06 |
ASTM D150 |
| Dielectric Strength, kV/mm [V/mil] |
24.17 [614] |
ASTM D149 |
| Volume Resistivity, ohm-cm |
2.62E+13 |
ASTM D257 |
| Surface Resistivity, ohm |
3.53+12 |
ASTM D257 |
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*Not Specifications
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