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IPC®- Association Connecting Electronics Industries
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Dual-Cure™ conformal coating

This product is RoHS Compliant

New! Dual-Cure Light- and Moisture-Cure Technology

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Dual-Cure electronic conformal coating and encapsulant technology represents the newest advancement in light/moisture cure technology. Dymax Dual-Cure conformal coatings and encapsulants for printed circuit boards (PCB)  and electronics assembly applications are specifically formulated to ensure complete cure in applications where shadowed areas on high-density circuit boards are a concern.

Previously, areas shadowed from light were managed by selective coating - eliminating the need to cure in shadowed areas or a secondary heat-cure process. Users needed to balance the cost of selective dispensing equipment and time/energy costs of a secondary heat cure.

Dual-Cure conformal coating and encapsulating materials enable shadowed areas on PCBs to cure over time with moisture, eliminating the need for that second process step or concerns of component life degradation due to temperature exposure. In addition, Dymax Dual-Cure products fluoresce bright blue when exposed to UV light and are easily dispensed. Read more regarding dispensing equipment selection and setup considerations for Dual-Cure materials.

 Features of Dymax Dual-Cure Conformal Coatings & Encapsulants:
bullet Solvent free
bullet Ability to light cure in seconds allows for immediate processing
bullet Faster secondary moisture cure than other conformal coatings and encapsulants
bullet Bright blue fluorescence for easy Q.C. inspection
bullet Chemically resistant
bullet Good component wetting
bullet Low concentration of free isocyanates
bullet Enable greater output and lower assembly costs
bullet RoHS Compliant

Dymax Dual-Cure Conformal Coatings & Encapsulants

Click on product numbers below for additional properties, features, applications, and product data sheets
Conformal
Coating
Electrical Properties*
PropertyValueTest Method
9481-E
Dielectric Constant (1 MHz) 3.90 ASTM D150
Dissipation Factor (1 MHz)0.01 ASTM D150
Dielectric Strength, kV/mm [V/mil] >59 [>1,500] MIL-I-46058C
Volume Resistivity, ohm-cm 1.01 x 1016 ASTM D257
Surface Resistivity, ohm 3.92 x 1015 ASTM D257

9482
Dielectric Constant (1 MHz) 3.61 ASTM D150
Dissipation Factor (1 MHz)0.03 ASTM D150
Dielectric Strength, kV/mm [V/mil] 43 [1,100] ASTM D149
Volume Resistivity, ohm-cm Pending ASTM D257
Surface Resistivity, ohm Pending ASTM D257
*Not Specifications   † Measured 100 hours after light cure

EncapsulantElectrical Properties*
PropertyValueTest Method
9101
Dielectric Constant (1 MHz) 3.11 ASTM D150
Dissipation Factor (1 MHz)0.06 ASTM D150
Dielectric Strength, kV/mm [V/mil] 25.73 [654] ASTM D149
Volume Resistivity, ohm-cm 2.93E+13 ASTM D257
Surface Resistivity, ohm 2.52E+12 ASTM D257

9102
Dielectric Constant (1 MHz) 3.05 ASTM D150
Dissipation Factor (1 MHz)0.06 ASTM D150
Dielectric Strength, kV/mm [V/mil] 25.87 [657] ASTM D149
Volume Resistivity, ohm-cm 4.89E+13 ASTM D257
Surface Resistivity, ohm 3.83E+12 ASTM D257

9103
Dielectric Constant (1 MHz) 2.80 ASTM D150
Dissipation Factor (1 MHz)0.06 ASTM D150
Dielectric Strength, kV/mm [V/mil] 24.17 [614] ASTM D149
Volume Resistivity, ohm-cm 2.62E+13 ASTM D257
Surface Resistivity, ohm 3.53+12 ASTM D257
*Not Specifications

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