Electronic Component Ruggedization
Ultra Light-Weld® 9309-SC cures upon exposure to UV/Visible
light and is designed for rapid ruggedization of printed circuit boards and
CSP reinforcement of fine pitch or leadless components. 9309-SC edgebond material ensures critical BGAs and chips on PCBs remain
intact throughout manufacturing, assembly qualification, and service
environments for the duration of the product lifecycle.
Use this material in applications where shock attenuation or ruggedization is
necessary, including use as an alternative to underfill. 9309-SC provides rapid
bonding to lead frame, PCB, silicon, and ceramic. Typical applications include chip ruggedization of handheld electronic
devices, mobile phones, laptop computers, gaming consoles, GPS, and digital
Request a Product Sample
See an example of our edgebond material on
a printed circuit board. Request a sample PCB.